Sr. Specialist, Principal Design (28783) na Amkor Technology, Inc.
Amkor Technology, Inc. · Tempe, United States Of America · Hybrid
- Senior
- Escritório em Tempe
Career Opportunities: Sr. Specialist, Principal Design (28783)Requisition ID 28783 - Posted - Design - Full-Time
Amkor Technology, Inc. (Nasdaq: AMKR) is the world’s largest U.S. headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint and solid partnerships with lead customers, Amkor delivers high-quality solutions that enable the world’s leading semiconductor and electronics companies to bring advanced technologies to market. The company’s comprehensive portfolio includes advanced packaging, wafer-level processing, and system-in-package solutions targeting applications for smartphones, data centers, artificial intelligence, automobiles and wearables. For more information visit amkor.com.
Position Summary:
Amkor Technology is hiring a technical resource with experience in package design. In this capacity, the Sr. Principal Design Specialist is expected to provide guidance and complete multiple complex designs to meet various customer requirements while understanding and implementing cost-saving techniques. The Sr. Principal Design Specialist has an expert understanding of IC package design and package design tools (Cadence, CAM, etc...) that are used in the industry. The ideal candidate will require little or no supervision and can provide technical support and training to colleagues. This position requires advanced skills and experience to meet or exceed customer requirements and solve complex design problems and customer issues. This role seeks opportunities to improve design techniques and streamline the design process; while exercising responsibility and authority in design decisions and exhibit exceptional customer service skills. As such, they demonstrate this pro-actively keeping the (internal or external) customer updated regularly. This role is considered a reliable consultant by customers.
Essential Duties and Responsibilities:
• Design Laminate (BGA) and Wafer Level packages, determining design rules, design optimization/verification, and selecting package type for thermal, mechanical, and electrical aspects
• Create detailed engineering drawings with no supervision
• Utilize skills and experience to solve design problems and customer issues
• Seek out opportunities to improve and advance design technology
• Exercise responsibility when making design-related decisions
• Create and sustain effective, productive, and quality partnerships between the design team and customers
• Interact with Amkor Product Group & Sales teams to ensure customer requirements are met; interface with internal and external customers as required
• Create documentation and perform record-keeping
• Lead by example while learning
• Other duties as assigned
Required Qualifications:
• Has an associate's degree in electrical engineering, mechanical engineering, or other relevant disciplines, with a minimum of 10 years of IC package design experience required
• Demonstrated experience using AutoCAD or equivalent software to create engineering drawings
• Has an expert-level of understanding of packaging design tools such as Cadence and techniques
• Ability to efficiently complete tasks with minimal or no supervision
• Self-motivated and team-oriented with the ability to meet aggressive schedules and able to work well in a team environment
• Effective verbal and written communication skills
Preferred Qualifications:
• Demonstrates an understanding of how to modify designs to improve performance
• Understands and implements cost-saving design techniques
• Has an advanced understanding of supplier and assembly processes - and can make tradeoffs when needed
• Basic knowledge of transmission line theory
• Has an advanced understanding of SI/PI principles
• Experience using design simulation tools
• Experience designing wafer-level packages using the L-Edit design tool
• Experience with Siemens Xpedition and Cam350 highly desired
Location:
Tempe, AZ. This position has a hybrid schedule. Candidates must reside near the local Amkor office or be willing to relocate to be considered.
Please note: This position may require access to ITAR sensitive information. Candidate must be a U.S. citizen, permanent resident, protected individual, or be eligible to qualify for a U.S. State Department export license.
Amkor is proud to be an Equal Opportunity Employer. We do not discriminate on the basis of race, color, ancestry, national origin, religion or religious creed, mental or physical disability, medical condition, genetic information, sex (including pregnancy, childbirth, and related medical conditions), sexual orientation, gender identity, gender expression, age, marital status, military or veteran status, citizenship, or other characteristics protected by state or federal law or local ordinance.
Amkor Technology, Inc. (Nasdaq: AMKR) is the world’s largest U.S. headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint and solid partnerships with lead customers, Amkor delivers high-quality solutions that enable the world’s leading semiconductor and electronics companies to bring advanced technologies to market. The company’s comprehensive portfolio includes advanced packaging, wafer-level processing, and system-in-package solutions targeting applications for smartphones, data centers, artificial intelligence, automobiles and wearables. For more information visit amkor.com.
Position Summary:
Amkor Technology is hiring a technical resource with experience in package design. In this capacity, the Sr. Principal Design Specialist is expected to provide guidance and complete multiple complex designs to meet various customer requirements while understanding and implementing cost-saving techniques. The Sr. Principal Design Specialist has an expert understanding of IC package design and package design tools (Cadence, CAM, etc...) that are used in the industry. The ideal candidate will require little or no supervision and can provide technical support and training to colleagues. This position requires advanced skills and experience to meet or exceed customer requirements and solve complex design problems and customer issues. This role seeks opportunities to improve design techniques and streamline the design process; while exercising responsibility and authority in design decisions and exhibit exceptional customer service skills. As such, they demonstrate this pro-actively keeping the (internal or external) customer updated regularly. This role is considered a reliable consultant by customers.
Essential Duties and Responsibilities:
• Design Laminate (BGA) and Wafer Level packages, determining design rules, design optimization/verification, and selecting package type for thermal, mechanical, and electrical aspects
• Create detailed engineering drawings with no supervision
• Utilize skills and experience to solve design problems and customer issues
• Seek out opportunities to improve and advance design technology
• Exercise responsibility when making design-related decisions
• Create and sustain effective, productive, and quality partnerships between the design team and customers
• Interact with Amkor Product Group & Sales teams to ensure customer requirements are met; interface with internal and external customers as required
• Create documentation and perform record-keeping
• Lead by example while learning
• Other duties as assigned
Required Qualifications:
• Has an associate's degree in electrical engineering, mechanical engineering, or other relevant disciplines, with a minimum of 10 years of IC package design experience required
• Demonstrated experience using AutoCAD or equivalent software to create engineering drawings
• Has an expert-level of understanding of packaging design tools such as Cadence and techniques
• Ability to efficiently complete tasks with minimal or no supervision
• Self-motivated and team-oriented with the ability to meet aggressive schedules and able to work well in a team environment
• Effective verbal and written communication skills
Preferred Qualifications:
• Demonstrates an understanding of how to modify designs to improve performance
• Understands and implements cost-saving design techniques
• Has an advanced understanding of supplier and assembly processes - and can make tradeoffs when needed
• Basic knowledge of transmission line theory
• Has an advanced understanding of SI/PI principles
• Experience using design simulation tools
• Experience designing wafer-level packages using the L-Edit design tool
• Experience with Siemens Xpedition and Cam350 highly desired
Location:
Tempe, AZ. This position has a hybrid schedule. Candidates must reside near the local Amkor office or be willing to relocate to be considered.
Please note: This position may require access to ITAR sensitive information. Candidate must be a U.S. citizen, permanent resident, protected individual, or be eligible to qualify for a U.S. State Department export license.
Amkor is proud to be an Equal Opportunity Employer. We do not discriminate on the basis of race, color, ancestry, national origin, religion or religious creed, mental or physical disability, medical condition, genetic information, sex (including pregnancy, childbirth, and related medical conditions), sexual orientation, gender identity, gender expression, age, marital status, military or veteran status, citizenship, or other characteristics protected by state or federal law or local ordinance.
Amkor Technology, Inc. (Nasdaq: AMKR) is the world’s largest U.S. headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint and solid partnerships with lead customers, Amkor delivers high-quality solutions that enable the world’s leading semiconductor and electronics companies to bring advanced technologies to market. The company’s comprehensive portfolio includes advanced packaging, wafer-level processing, and system-in-package solutions targeting applications for smartphones, data centers, artificial intelligence, automobiles and wearables. For more information visit amkor.com.
Position Summary:
Amkor Technology is hiring a technical resource with experience in package design. In this capacity, the Sr. Principal Design Specialist is expected to provide guidance and complete multiple complex designs to meet various customer requirements while understanding and implementing cost-saving techniques. The Sr. Principal Design Specialist has an expert understanding of IC package design and package design tools (Cadence, CAM, etc...) that are used in the industry. The ideal candidate will require little or no supervision and can provide technical support and training to colleagues. This position requires advanced skills and experience to meet or exceed customer requirements and solve complex design problems and customer issues. This role seeks opportunities to improve design techniques and streamline the design process; while exercising responsibility and authority in design decisions and exhibit exceptional customer service skills. As such, they demonstrate this pro-actively keeping the (internal or external) customer updated regularly. This role is considered a reliable consultant by customers.
Essential Duties and Responsibilities:
• Design Laminate (BGA) and Wafer Level packages, determining design rules, design optimization/verification, and selecting package type for thermal, mechanical, and electrical aspects
• Create detailed engineering drawings with no supervision
• Utilize skills and experience to solve design problems and customer issues
• Seek out opportunities to improve and advance design technology
• Exercise responsibility when making design-related decisions
• Create and sustain effective, productive, and quality partnerships between the design team and customers
• Interact with Amkor Product Group & Sales teams to ensure customer requirements are met; interface with internal and external customers as required
• Create documentation and perform record-keeping
• Lead by example while learning
• Other duties as assigned
Required Qualifications:
• Has an associate's degree in electrical engineering, mechanical engineering, or other relevant disciplines, with a minimum of 10 years of IC package design experience required
• Demonstrated experience using AutoCAD or equivalent software to create engineering drawings
• Has an expert-level of understanding of packaging design tools such as Cadence and techniques
• Ability to efficiently complete tasks with minimal or no supervision
• Self-motivated and team-oriented with the ability to meet aggressive schedules and able to work well in a team environment
• Effective verbal and written communication skills
Preferred Qualifications:
• Demonstrates an understanding of how to modify designs to improve performance
• Understands and implements cost-saving design techniques
• Has an advanced understanding of supplier and assembly processes - and can make tradeoffs when needed
• Basic knowledge of transmission line theory
• Has an advanced understanding of SI/PI principles
• Experience using design simulation tools
• Experience designing wafer-level packages using the L-Edit design tool
• Experience with Siemens Xpedition and Cam350 highly desired
Location:
Tempe, AZ. This position has a hybrid schedule. Candidates must reside near the local Amkor office or be willing to relocate to be considered.
Please note: This position may require access to ITAR sensitive information. Candidate must be a U.S. citizen, permanent resident, protected individual, or be eligible to qualify for a U.S. State Department export license.
Amkor is proud to be an Equal Opportunity Employer. We do not discriminate on the basis of race, color, ancestry, national origin, religion or religious creed, mental or physical disability, medical condition, genetic information, sex (including pregnancy, childbirth, and related medical conditions), sexual orientation, gender identity, gender expression, age, marital status, military or veteran status, citizenship, or other characteristics protected by state or federal law or local ordinance.
Amkor Technology, Inc. (Nasdaq: AMKR) is the world’s largest U.S. headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint and solid partnerships with lead customers, Amkor delivers high-quality solutions that enable the world’s leading semiconductor and electronics companies to bring advanced technologies to market. The company’s comprehensive portfolio includes advanced packaging, wafer-level processing, and system-in-package solutions targeting applications for smartphones, data centers, artificial intelligence, automobiles and wearables. For more information visit amkor.com.
Position Summary:
Amkor Technology is hiring a technical resource with experience in package design. In this capacity, the Sr. Principal Design Specialist is expected to provide guidance and complete multiple complex designs to meet various customer requirements while understanding and implementing cost-saving techniques. The Sr. Principal Design Specialist has an expert understanding of IC package design and package design tools (Cadence, CAM, etc...) that are used in the industry. The ideal candidate will require little or no supervision and can provide technical support and training to colleagues. This position requires advanced skills and experience to meet or exceed customer requirements and solve complex design problems and customer issues. This role seeks opportunities to improve design techniques and streamline the design process; while exercising responsibility and authority in design decisions and exhibit exceptional customer service skills. As such, they demonstrate this pro-actively keeping the (internal or external) customer updated regularly. This role is considered a reliable consultant by customers.
Essential Duties and Responsibilities:
• Design Laminate (BGA) and Wafer Level packages, determining design rules, design optimization/verification, and selecting package type for thermal, mechanical, and electrical aspects
• Create detailed engineering drawings with no supervision
• Utilize skills and experience to solve design problems and customer issues
• Seek out opportunities to improve and advance design technology
• Exercise responsibility when making design-related decisions
• Create and sustain effective, productive, and quality partnerships between the design team and customers
• Interact with Amkor Product Group & Sales teams to ensure customer requirements are met; interface with internal and external customers as required
• Create documentation and perform record-keeping
• Lead by example while learning
• Other duties as assigned
Required Qualifications:
• Has an associate's degree in electrical engineering, mechanical engineering, or other relevant disciplines, with a minimum of 10 years of IC package design experience required
• Demonstrated experience using AutoCAD or equivalent software to create engineering drawings
• Has an expert-level of understanding of packaging design tools such as Cadence and techniques
• Ability to efficiently complete tasks with minimal or no supervision
• Self-motivated and team-oriented with the ability to meet aggressive schedules and able to work well in a team environment
• Effective verbal and written communication skills
Preferred Qualifications:
• Demonstrates an understanding of how to modify designs to improve performance
• Understands and implements cost-saving design techniques
• Has an advanced understanding of supplier and assembly processes - and can make tradeoffs when needed
• Basic knowledge of transmission line theory
• Has an advanced understanding of SI/PI principles
• Experience using design simulation tools
• Experience designing wafer-level packages using the L-Edit design tool
• Experience with Siemens Xpedition and Cam350 highly desired
Location:
Tempe, AZ. This position has a hybrid schedule. Candidates must reside near the local Amkor office or be willing to relocate to be considered.
Please note: This position may require access to ITAR sensitive information. Candidate must be a U.S. citizen, permanent resident, protected individual, or be eligible to qualify for a U.S. State Department export license.
Amkor is proud to be an Equal Opportunity Employer. We do not discriminate on the basis of race, color, ancestry, national origin, religion or religious creed, mental or physical disability, medical condition, genetic information, sex (including pregnancy, childbirth, and related medical conditions), sexual orientation, gender identity, gender expression, age, marital status, military or veteran status, citizenship, or other characteristics protected by state or federal law or local ordinance.
