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Hybrid 2025 Intern - Packaging Engineer at NXP Semiconductors N.V.

NXP Semiconductors N.V. ·  Tianjin (Xinghua), United States Of America · Hybrid

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Job Description:
This position is a packaging front-end R&D intern, and will be focusing on IC (integrated circuit) packaging technology research and development, work with global team to finish development projects and other tasks as listed below:

  • New packaging technology development
  • New package related process development
  • Advanced material interface study
  • Advanced IC package failure analysis
  • Coordinate/lead development project independently
  • Communication/cooperation among global teams (US/Europe/Malaysia/Japan/France/etc.)


Qualification:

  • Pursuing in bachelor or master degree.
  • Major on: Metallic Materials Engineering; Polymer Materials Engineering; Mechanical Engineering and Automation.
  • Good communication of oral and written English.


More information about NXP in Greater China...

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