Hybrid 2025 Intern - Packaging Engineer bei NXP Semiconductors N.V.
NXP Semiconductors N.V. · Tianjin (Xinghua), Vereinigte Staaten Von Amerika · Hybrid
- Optionales Büro in Tianjin (Xinghua)
Job Description:
This position is a packaging front-end R&D intern, and will be focusing on IC (integrated circuit) packaging technology research and development, work with global team to finish development projects and other tasks as listed below:
- New packaging technology development
- New package related process development
- Advanced material interface study
- Advanced IC package failure analysis
- Coordinate/lead development project independently
- Communication/cooperation among global teams (US/Europe/Malaysia/Japan/France/etc.)
Qualification:
- Pursuing in bachelor or master degree.
- Major on: Metallic Materials Engineering; Polymer Materials Engineering; Mechanical Engineering and Automation.
- Good communication of oral and written English.
