- Professional
- Optionales Büro in Tempe
One team. Global challenges. Infinite opportunities. At Viasat, we’re on a mission to deliver connections with the capacity to change the world. For more than 35 years, Viasat has helped shape how consumers, businesses, governments and militaries around the globe communicate. We’re looking for people who think big, act fearlessly, and create an inclusive environment that drives positive impact to join our team.
What you'll do:Viasat is a rapidly growing technology company that designs, deploys and operates cutting edge SATCOM products and services as well as advanced Military and Government programs. At Viasat you'll work with highly-motivated engineers in an exciting, dynamic, yet informal environment in the development of RF- mmWave and high speed digital semiconductor packaging solutions and systems.
The packaging development process includes package definition, stack-up, substrate layout, bond diagram, simulation, technical risk/cost assessment, materials and process characterization, and compilation of formal documentation.
In this role, you will have the opportunity to be a team member with other top notch mechanical engineers. Your experience in physical design of microelectronics hardware will be valued as your become the go to person in performing structural, thermal, and dynamic analysis for commercial, military, or space hardware. You will be empowered to make positive contributions and decisions in design, testing, and prototype fabrication. Your people skills will come to play as you work closely with team mates, subcontractors, and our customers.
What you'll need:- 5+ years experience in RF/Microwave module level electronic packaging design or similar work.
- Experience with 2D and/or 3D mechanical design tools
- Knowledge of thermal analysis of electronic packaging design
- Knowledge of finite element modeling techniques and software
- Knowledge of packaging microwave electronics for space environments
- Bachelor's Degree in Mechanical Engineering or equivalent
- US Government position. US Citizenship required
- Ability to travel up to 10%
- Masters of Science Degree in Mechanical Engineering
- Experience with the following tools: Solidworks, Solidedge, ANSYS, CATIA
- Clearance: TS/SCI
Viasat is proud to be an equal opportunity employer, seeking to create a welcoming and diverse environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, gender, gender identity or expression, sexual orientation, national origin, ancestry, physical or mental disability, medical condition, marital status, genetics, age, or veteran status or any other applicable legally protected status or characteristic. If you would like to request an accommodation on the basis of disability for completing this on-line application, please click here.
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