- Professional
- Optionales Büro in Hudson
Job Description
Key Responsibilities:
- Translate system requirements into successful system architectures and complex printed board assembly designs.
- Create board schematic and layouts using Cadence Allegro System Capture
- Perform trade studies and prototyping to down select critical components, develop optimized electronic architectural solutions (SWAP), verify complex custom circuit blocks of an overarching system
- Document design verification tests and design review documentation
- Actively participate in knowledge-sharing culture via mentoring
- Work within schedule and budget constraints and elevate concerns if challenges arise.
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About BAE Systems Electronic Systems
This position will be posted for at least 5 calendar days. The posting will remain active until the position is filled, or a qualified pool of candidates is identified.
Clearance Level – Must be able to obtain for position
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Union Job
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Required Skills and Education
- Bachelor’s degree in Electrical Engineering
- Minimum of four years of relevant experience in related industry (i.e. defense, electronics) or two years with a Master’s Degree
- Solid understanding of fundamentals of digital, analog, power, and mixed-signal electronics and interface/communication standards such as UART, SPI, QSPI, I2C, USB, Ethernet, ARINC 429, MIL-STD-1553, PCIe
- PCB/CCA design experience, with an emphasis on DFA and DFM optimization, for complex rigid and rigid-flex mixed-signal HDI PCBs.
- Proficient at testing and troubleshooting analog, digital, and power supply-based circuits in a lab setting using oscilloscopes, bench supplies, vector network analyzers, spectrum analyzers, frequency counters, arbitrary waveform generators, function generators, logic analyzers
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Regular or Temporary
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Preferred Skills and Education
- Master’s degree in Electrical Engineering, RF Engineering, or equivalent
- Familiarity designing with FPGAs, System-On-Chips (SoC), and/or CPLDs using VHDL and/or Verilog
- Familiarity designing and writing embedded SW for microcontroller-based systems and modules
- Knowledge of system level EMI mitigation techniques along with proper grounding/shielding architecture
- Experience with high-speed mixed signal HDI PCB design, constraints management, and proper routing for interfaces with lane rates exceeding 1Gbps
- Hands-on experience with high voltage testing with an emphasis on measurement safety
- Experience with low noise, wide bandwidth, low power, Analog Front-End systems
- Understanding of SPICE simulators and simulation methods, preferably using LTSpice, TINA, PSpice Experience with the following PCB and CCA design features: micro-via and blind/buried vias, stacked micro-vias, via-in-pad and via fill/cap processes, controlled impedances, backdrilling, high pin count / fine-pitch BGAs, Chip-on-Board (COB), QFNs/DFNs, LGAs, and other advanced IC package types
- Familiarity with phase/gain margin stability analysis and other small signal analysis techniques, as it applies to analog circuit design and switch-mode power supply design
- Familiarity with Signal Integrity and Power Integrity, as it applies to proper layout techniques
- Active DoD Security Clearance – Secret