Homeoffice Temasek Undergraduate Overseas Scholarship (Singapore, SG, 238891) bei None
None · Singapore, Singapur · Remote
Introduction
The Temasek Undergraduate Overseas Scholarship is a programme awarded to exceptional polytechnic graduates who demonstrate academic excellence, outstanding extracurricular involvement, and a strong passion for the science, technology, engineering, and mathematics (STEM) fields.
With the opportunity to pursue further education at one of the top overseas universities, the Scholars are required to express desire to making meaningful contributions to Singapore’s innovation and growth upon graduation.
Scholarship Benefits
Tuition and other compulsory fees over the course of study
Monthly living allowance
Development programmes, including approved overseas exchange programmes
Access to internships opportunities within the Temasek ecosystem
Mentoring opportunities from a network of professionals
One-time relocation allowance including return airfare
One-time pre-studies allowance
Application fees to up to five overseas universities
- Visa processing fees
Eligibility Criteria
Interested polytechnic students are welcome to apply prior to commencing their undergraduate degree. You may apply prior to receiving your final Cumulative GPA and examination results.
Applicants must: Be a Singapore citizen
Be a local polytechnic graduate or graduating from a local polytechnic
Be accepted or planning to enroll in a STEM undergraduate course at an overseas university (excluding Medicine and Dentistry)
Have a Gross Monthly Household Income of ≤ S$15,000 [1] at the point of admission
Demonstrate commitment to contribute to the STEM economy in Singapore
A provisional scholarship offer may be extended if an applicant is found suitable. This will be subject to confirmation upon the release of his/her final cumulative GPA, examination results, and acceptance into an overseas university.
Be a Singapore citizen
Be a local polytechnic graduate or graduating from a local polytechnic
Be accepted or planning to enroll in a STEM undergraduate course at an overseas university (excluding Medicine and Dentistry)
Have a Gross Monthly Household Income of ≤ S$15,000 [1] at the point of admission
Demonstrate commitment to contribute to the STEM economy in Singapore
Bond Period
Upon graduation, the scholar is required to contribute to Singapore’s innovation and growth and serve a 4-year bond to work in Singapore or with a Singapore-headquartered company, in a STEM-related role.
Application Details
Deadline for Submission: 28 September 2025 Applications will be assessed on a rolling basis until September 2025. Only shortlisted applicants will be notified.
Applications will be assessed on a rolling basis until September 2025. Only shortlisted applicants will be notified.