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CMP Process Engineer at IBM

IBM · Town of Yorktown, United States Of America · Hybrid

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Introduction

At IBM Research, we are the innovation engine of IBM. Exploring what’s next in computing and shaping the technologies the world will rely on tomorrow. From advancing AI and hybrid cloud to pioneering practical quantum computing, we anticipate challenges and unlock new opportunities for clients, partners, and society. Working in Research means joining a team that accelerates discovery at the intersection of high-performance computing, AI, quantum, and cloud. You’ll collaborate with leading scientists, engineers, and visionaries to push boundaries and turn ideas into reality. With a culture built on curiosity, creativity, and collaboration, IBM Research offers the opportunity to grow your career while contributing to breakthroughs that transform industries and change the world.

Your role and responsibilities

The Advanced Planarization Processes group is seeking a chemical mechanical planarization (CMP) process engineer to drive the research, development and optimization of planarization technologies supporting current and future nanoscale devices and integration schemes.

The successful candidate will develop new CMP processes working in a dynamic R&D environment that uses an interdisciplinary approach—combining materials science, surface science, electrochemistry, and physical characterization—to create and optimize processes for CMOS and interconnect fabrication at upcoming technology nodes through both internal collaboration and external partnership projects.

In addition, the process engineer will work closely with wafer lot owners and subject experts in lithography, plasma processing, electrodeposition, and other semiconductor processes to enable end‑to‑end module integration. They will lead fabrication of novel device structures—including those for Quantum, AI, and magnetic random‑access memory (MRAM).

Strong communication skills, familiarity with semiconductor processes and tool operations, active engagement in a collaborative team environment, and the ability to provide technical leadership in processing are all critical for success in this role.

Required technical and professional expertise

  • BS or MS in chemistry, physical chemistry, chemical engineering, surface science, or related field.

  • Prior wafer handling experience

  • Semiconductor processing experience.

Preferred technical and professional experience

  • 3-5 years Prior wafer-level, semiconductor processing experience.

IBM is committed to creating a diverse environment and is proud to be an equal-opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, gender, gender identity or expression, sexual orientation, national origin, caste, genetics, pregnancy, disability, neurodivergence, age, veteran status, or other characteristics. IBM is also committed to compliance with all fair employment practices regarding citizenship and immigration status.

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