- Professional
- Office in San Jose
Job Details:
Job Description:
About the Role:
As a Physical Design Engineer at Altera, you will play a critical role in the backend implementation flow — from RTL/netlist through GDSII/tape-out for FPGA/SoC devices. You will collaborate with architecture, logic design, DFT, CAD/EDA, and manufacturing teams to achieve performance, power, and area (PPA) goals, with a particular emphasis on programmable logic structures, block and full-chip integration, and the unique demands of FPGA technologies (e.g., configurable logic blocks, routing fabrics, I/O rings, on-chip power domains).
Key Responsibilities:
Execute physical design implementation tasks (floorplanning, power planning, placement, clock tree synthesis (CTS), routing, engineering change orders (ECO), extraction, sign-off preparation) from netlist to GDSII.
Apply PPA optimization techniques (performance/timing closure, power reduction, area efficiency) across block-level and full-chip hierarchies.
Collaborate with front-end design, architecture, and CAD/EDA tool teams to ensure physical design constraints, timing budgets, power budgets, and DFT insertions are met.
Develop and enhance physical design flows, methodologies, scripts, and automation frameworks (TCL, Python, Perl) to accelerate turnaround, improve QoR, and reduce manual intervention.
Participate in timing, power, EM/IR integrity, signal/power noise, and DRC/LVS/ERC verification for sign-off readiness.
Integrate FPGA-specific physical design aspects: configurable logic block placement, fabric routing, I/O ring optimization, power domains for programmable regulation, and yield optimization.
Debug physical design issues and interact with CAD tool vendors and internal tool teams to drive tool enhancements or workarounds.
Salary Range
The pay range below is for Bay Area California only. Actual salary may vary based on a number of factors including job location, job-related knowledge, skills, experiences, trainings, etc. We also offer incentive opportunities that reward employees based on individual and company performance.
$127,400 - $184,400 USD
We use artificial intelligence to screen, assess, or select applicants for the position.
Qualifications:
Minimum Qualifications:
Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field with 6+ years of experience in:
Hands-on digital/SoC physical design (synthesis through P&R and sign-off).
Industry-standard EDA tools (e.g., Synopsys IC Compiler/Fusion, Cadence Innovus/Encounter, PrimeTime, STAR-RCX, Calibre) for high-speed digital ASIC/SoC implementation.
Scripting/programming (TCL, Python, Perl, shell) for flow automation and productivity enhancement.
Physical design flow: floorplanning, CTS, placement, routing, power domain gating, clock domain crossing, multi-power domain design, timing closure, ECOs, and DRC/LVS/DFM resolution.
Power/IR analysis, signal/power integrity reporting, and corrective action planning.
Interfacing with front-end teams (RTL, architecture), CAD/EDA tool teams, and manufacturing/packaging teams.
Preferred Qualifications:
Experience with advanced process nodes (7nm, 5nm or smaller) or FPGA/programmable logic device flows.
Familiarity with FPGA architecture: routing fabrics, programmable logic blocks (PLBs), on-chip networks, I/O rings, static/dynamic reconfiguration.
Expertise in low-power design methodologies, power grid design, power gating, multi-voltage domain implementation, and power sign-off flows.
Prior exposure to full-chip integration flows (block-to-chip convergence) and high-frequency (1 GHz+) timing closure.
Experience in high-volume manufacturing environments, including yield and DFM/DFY considerations.
Experience mentoring or leading small physical design sub-teams or owning major P&R blocks.
