Eng I - Matl & Proc bei BAE Systems
BAE Systems · Cedar Rapids, Vereinigte Staaten Von Amerika · Hybrid
- Junior
- Optionales Büro in Cedar Rapids
Job Description
Because this role involves a combination of collaborative/in-person and independent work, it will take the form of a hybrid work format, with time split between working onsite and remotely.
You don’t see it, but it’s there. Our employees work on the world’s most advanced electronics – from saving emissions in the City of Lights to powering the Mars Rover to protecting the F35 fighter jet. At Electronic Systems, you’ll be among the brightest minds, working on the aerospace and defense industry’s most difficult problems. Drawing strength from our differences, we’re innovating for the future. And you can, too. Our flexible work environment provides you a chance to change the world without giving up your personal life. We put our customers first – exemplified by our missions: “We Protect Those Who Protect Us®” and “We Innovate For Those Who Move The WorldTM.” Sound like a team you want to be a part of? Come build your career with BAE Systems
In Navigation and Sensor Systems, we design and manufacture state-of-the-art systems and technology that enable our customers to execute their precision navigation missions.
BAE Systems is seeking a recent college graduate with a degree in Electrical, Aerospace, Mechanical, or Materials Engineering to join our team as a Microelectronics Packaging Design Engineer. As a key member of our team, you will have the opportunity to design and develop innovative microelectronics packages that support the next generation of Global Positioning (GPS) products and other platforms that enable national defense.
Job Summary:
In this entry-level role, you will work closely with experienced engineers to design, develop, and qualify state-of-the-art miniaturized electronic devices. You will contribute to all phases of the engineering life cycle, including design, process development, and factory support. This is an excellent opportunity to apply your knowledge of engineering principles to a dynamic and fast-paced field.
Primary Responsibilities:
You don’t see it, but it’s there. Our employees work on the world’s most advanced electronics – from saving emissions in the City of Lights to powering the Mars Rover to protecting the F35 fighter jet. At Electronic Systems, you’ll be among the brightest minds, working on the aerospace and defense industry’s most difficult problems. Drawing strength from our differences, we’re innovating for the future. And you can, too. Our flexible work environment provides you a chance to change the world without giving up your personal life. We put our customers first – exemplified by our missions: “We Protect Those Who Protect Us®” and “We Innovate For Those Who Move The WorldTM.” Sound like a team you want to be a part of? Come build your career with BAE Systems
In Navigation and Sensor Systems, we design and manufacture state-of-the-art systems and technology that enable our customers to execute their precision navigation missions.
BAE Systems is seeking a recent college graduate with a degree in Electrical, Aerospace, Mechanical, or Materials Engineering to join our team as a Microelectronics Packaging Design Engineer. As a key member of our team, you will have the opportunity to design and develop innovative microelectronics packages that support the next generation of Global Positioning (GPS) products and other platforms that enable national defense.
Job Summary:
In this entry-level role, you will work closely with experienced engineers to design, develop, and qualify state-of-the-art miniaturized electronic devices. You will contribute to all phases of the engineering life cycle, including design, process development, and factory support. This is an excellent opportunity to apply your knowledge of engineering principles to a dynamic and fast-paced field.
Primary Responsibilities:
- Assist in the development of microelectronics packaging concepts and technologies
- Participate in product development activities, including packaging design and road mapping efforts
- Contribute to program pursuits and bid estimates
- Support prototype package builds and evaluation efforts
- Assist in the qualification of microelectronics packages
- Participate in failure analysis for microelectronics packages
- Provide support for factory transition of products and manufacturing of microelectronics assemblies
- Bachelor of Science degree in Electrical, Mechanical, or Materials Engineering
- Strong foundation in engineering principles and materials science
- Interest in microelectronics packaging design and development
- Excellent communication and teamwork skills
- Opportunity to work on cutting-edge microelectronics packaging design and development projects
- Collaborative and dynamic work environment
- Professional development and growth opportunities
- Competitive salary and benefits package
State/Province
Iowa
Salary Max Point
98372
About BAE Systems Electronic Systems
BAE Systems, Inc. is the U.S. subsidiary of BAE Systems plc, an international defense, aerospace and security company which delivers a full range of products and services for air, land and naval forces, as well as advanced electronics, security, information technology solutions and customer support services. Improving the future and protecting lives is an ambitious mission, but it’s what we do at BAE Systems. Working here means using your passion and ingenuity where it counts – defending national security with breakthrough technology, superior products, and intelligence solutions. As you develop the latest technology and defend national security, you will continually hone your skills on a team—making a big impact on a global scale. At BAE Systems, you’ll find a rewarding career that truly makes a difference. Electronic Systems (ES) is the global innovator behind BAE Systems’ game-changing defense and commercial electronics. Exploiting every electron, we push the limits of what is possible, giving our customers the edge and our employees opportunities to change the world. Our products and capabilities can be found everywhere – from the depths of the ocean to the far reaches of space. At our core are more than 14,000 highly talented Electronic Systems employees with the brightest minds in the industry, we make an impact – for our customers and the communities we serve.
This position will be posted for at least 5 calendar days. The posting will remain active until the position is filled, or a qualified pool of candidates is identified.
This position will be posted for at least 5 calendar days. The posting will remain active until the position is filled, or a qualified pool of candidates is identified.
Clearance Level – Must be able to obtain for position
Secret
Shift
1st Shift
Union Job
None
Business Area
Precision Strike & Sensing Solutions
City
Cedar Rapids
Job Posting Title
Microelectronics Packaging Engineer - (Hybrid)
Required Skills and Education
- US Citizenship
- All applicants must be able to obtain a DoD Security Clearance at time of application (REQUIRED)
- Bachelor's degree in Engineering with focus on Electrical, Aerospace, Mechanical, or Materials Engineering
Company
BAE_BAE SYSTEMS Info&Elec Sys Intg
Postal Code
52404
Regular or Temporary
Regular
Posting Requirements
Internal/External
Department
1HC_ES PS3 Engineering
Country
United States
Job Family
Materials
Preferred Skills and Education
- Microelectronics design and manufacturing assembly
- Microelectronics packaging materials and materials properties
- Electronic component reliability testing
- Post wafer fabrication processes
- Failure analysis techniques
- Additive manufacturing
- Wafer fabrication processes
- Advanced thermal packaging design
- RF packaging design
Salary Min Point
57866
Travel Percentage
<10%
U.S. Person Required
Yes
Typical Education and Experience
Typically a High School Diploma and 4 years work experience or equivalent experience
Job Category
Engineering & Technology
Physical location of the job
Hybrid
U.S. Citizenship Required
Yes
