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Technical Intern 4 bei BAE Systems

BAE Systems · Cedar Rapids, Vereinigte Staaten Von Amerika · Hybrid

53.560,00 $  -  72.306,00 $

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Job Description

Job Description:
Join our team at BAE Systems as a Microelectronics Packaging Design Engineer intern and work on cutting-edge projects that shape the future of aerospace and defense. Our hybrid work format allows for a balance of collaborative in-person and independent remote work.

About Us:
At BAE Systems, we're dedicated to innovating for the future and protecting those who protect us. Our employees work on the world's most advanced electronics, from saving emissions in major cities to powering the Mars Rover. We're a team of bright minds working together to solve the industry's most difficult problems.

Internship Summary:
As a Microelectronics Packaging Design Engineer intern, you'll work closely with experienced engineers to design, develop, and qualify state-of-the-art miniaturized electronic devices. This is an excellent opportunity to apply your knowledge of engineering principles to a dynamic and fast-paced field.
Responsibilities:
  • Assist in the development of microelectronics packaging concepts and technologies
  • Participate in product development activities, including packaging design and road mapping efforts
  • Contribute to program pursuits and bid estimates
  • Support prototype package builds and evaluation efforts
  • Assist in the qualification of microelectronics packages
  • Participate in failure analysis for microelectronics packages
  • Provide support for factory transition of products and manufacturing of microelectronics assemblies
Requirements:
  • Currently pursuing a degree in Electrical, Aerospace, Mechanical, or Materials Engineering
  • Strong foundation in engineering principles and materials science
  • Interest in microelectronics packaging design and development
  • Excellent communication and teamwork skills
What We Offer:
  • Opportunity to work on cutting-edge microelectronics packaging design and development projects
  • Collaborative and dynamic work environment
  • Professional development and growth opportunities
  • Competitive stipend and benefits package

State/Province

Iowa

Salary Max Point

72306

About BAE Systems Electronic Systems

BAE Systems, Inc. is the U.S. subsidiary of BAE Systems plc, an international defense, aerospace and security company which delivers a full range of products and services for air, land and naval forces, as well as advanced electronics, security, information technology solutions and customer support services. Improving the future and protecting lives is an ambitious mission, but it’s what we do at BAE Systems. Working here means using your passion and ingenuity where it counts – defending national security with breakthrough technology, superior products, and intelligence solutions. As you develop the latest technology and defend national security, you will continually hone your skills on a team—making a big impact on a global scale. At BAE Systems, you’ll find a rewarding career that truly makes a difference. Electronic Systems (ES) is the global innovator behind BAE Systems’ game-changing defense and commercial electronics. Exploiting every electron, we push the limits of what is possible, giving our customers the edge and our employees opportunities to change the world. Our products and capabilities can be found everywhere – from the depths of the ocean to the far reaches of space. At our core are more than 14,000 highly talented Electronic Systems employees with the brightest minds in the industry, we make an impact – for our customers and the communities we serve.

This position will be posted for at least 5 calendar days. The posting will remain active until the position is filled, or a qualified pool of candidates is identified.

Clearance Level – Must be able to obtain for position

Secret

Shift

1st Shift

Union Job

None

Business Area

Precision Strike & Sensing Solutions

City

Cedar Rapids

Job Posting Title

Microelectronics Packaging Intern - Summer 2026

Required Skills and Education

  • US Person
  • All applicants must be able to obtain a DoD Security Clearance at time of application (REQUIRED)
  • Currently pursuing a degree in Engineering with focus on Electrical, Aerospace, Mechanical, or Materials Engineering 

Company

BAE_BAE SYSTEMS Info&Elec Sys Intg

Postal Code

52404

Regular or Temporary

Temporary

Posting Requirements

Internal/External

Department

1HC_ES PS3 Engineering

Country

United States

Job Family

Intern/Co-op

Preferred Skills and Education

  • Microelectronics design and manufacturing assemble
  • Microelectronics packaging materials and materials properties
  • Electronic component reliability testing
  • Post wafer fabrication processes
  • Failure analysis techniques
  • Additive manufacturing
  • Wafer fabrication processes
  • Advanced thermal packaging design
  • RF packaging design

Salary Min Point

53560

Travel Percentage

0%

U.S. Person Required

Yes

Typical Education and Experience

.

Job Category

Engineering & Technology

Physical location of the job

Full-time onsite

U.S. Citizenship Required

Yes
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