Senior Device Engineer bei Intel

Job Details:

Job Description: 

Organization Overview Manufacturing Development and Customer Engineering (MDCE) serves as the bridge between advanced technology development and scalable manufacturing, ensuring innovative solutions can be successfully produced and delivered to foundry customers.

Position Summary MDCE Device org is seeking an experienced device technologist with foundry technology development background. You'll develop and customize technologies for high volume manufacturing, focusing on general-purpose logic CMOS technologies supporting high performance compute, mobile, mixed signal, memory controllers, and other applications. Working with engineering teams, you'll push device performance, power efficiency, and scaling boundaries while contributing to Intel Foundry's semiconductor solutions for diverse markets.

You'll collaborate with Process Integration, Yield Analysis and Defect engineering teams, fab module/yield teams and TD team members to achieve yield ramp-up and process optimization in early production stage, supporting internal and external customers.

Key Responsibilities 

• Own engineering projects to execute HVM yield roadmap, device targeting and attain performance targets

• Collaborate with Technology Development team to develop new device technology, customize device architecture per customer request and import to production fabs

• Participate or lead cross-organizational teams to identify root cause of device-related yield/performance issues and define mitigation plan to meet committed production targets

• Own NPI (New Product Introduction) in production fabs and perform device-related process optimization to meet foundry customer specifications and requirements

• Work with Process Integration engineers to drive process simplification and implement cost reduction engineering opportunities

The ideal candidate should exhibit:

Strong interpersonal skills including influencing, engaging and motivating

Qualifications:

Minimum Qualifications • Bachelor's degree in Electrical Engineering, Physics or Materials Science. Other related science and engineering degrees considered based on industry experience

6+ years of experience in:  

• Advanced node semiconductor industry in Device Integration

• FinFET technology development or high-volume manufacturing

• Device Physics and hands-on application in real-world fab environment

Preferred Qualifications 

• Advanced degree (Master's or Ph.D.) in Electrical Engineering, Physics or Materials Science

• Experience in project/program management and/or task force team lead

• Experience serving external Foundry customers through technical interactions

• Experience in GAA (Gate-All-Around) technology architecture

• Experience in new semiconductor technology development

• Experience with FEOL (Front-End-Of-Line) Integration teams including Fin, Poly, Source/Drain and Gate segments on device performance improvement and targeting with technical understanding on how FEOL process changes impact device parameters

          

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Arizona, Phoenix

Additional Locations:

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits:

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation.  Find more information about all of our Amazing Benefits here:

https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003

 

 

Annual Salary Range for jobs which could be performed in the US:

 

 

$153,100.00-216,140.00 USD

 

 

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

 

 

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change. Jetzt bewerben