- Senior
- Optionales Büro in Hudson
Job Description
Key Responsibilities:
- Translate system requirements into successful system architectures and complex printed board assembly designs.
- Create board schematic and layouts using Cadence Allegro System Capture
- Perform trade studies and prototyping to down select critical components, develop optimized electronic architectural solutions (SWAP), verify complex custom circuit blocks of an overarching system
- Document design verification tests and design review documentation
- Lead a small team
- Mentor more junior engineers and actively contribute to knowledge-sharing culture
- Work within schedule and budget constraints and elevate concerns if challenges arise.
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About BAE Systems Electronic Systems
This position will be posted for at least 5 calendar days. The posting will remain active until the position is filled, or a qualified pool of candidates is identified.
Clearance Level – Must be able to obtain for position
Shift
Union Job
Business Area
City
Job Posting Title
Required Skills and Education
- Bachelor’s degree in Electrical Engineering
- Minimum of eight years of relevant experience in related industry (i.e. defense, electronics) or six years with a Master’s Degree
- Significant experience designing mixed signal systems, including analog, high speed digital, and power supply circuits in harsh electromagnetic environments (e.g. MIL-STD-461, MIL-STD-810)
- Significant experience with low noise, wide bandwidth, low power, Analog Front-End systems
- Very comfortable testing and troubleshooting analog, digital, and power supply-based circuits in a lab setting using oscilloscopes, bench supplies, vector network analyzers, spectrum analyzers, frequency counters, arbitrary waveform generators, function generators, logic analyzers
- Familiarity with phase/gain margin stability analysis and other small signal analysis techniques, as it applies to analog circuit design and switch-mode power supply design
- Experience designing high-voltage DC-DC converters for low power applications with a strong understanding of the varying topologies
- Hands-on experience with high voltage testing with an emphasis on measurement safety
- Familiarity with standard interface/communication protocols such as UART, SPI, QSPI, I2C, USB, Ethernet, ARINC 429, MIL-STD-1553, PCIe
- Understanding of SPICE simulators and simulation methods, preferably using LTSpice, TINA, PSpice
- Significant PCB/CCA design experience, with an emphasis on DFA and DFM optimization, for complex rigid and rigid-flex mixed-signal HDI PCBs including, but not limited to, the following PCB and CCA design features: micro-via and blind/buried vias, stacked micro-vias, via-in-pad and via fill/cap processes, controlled impedances, backdrilling, high pin count / fine-pitch BGAs, Chip-on-Board (COB), QFNs/DFNs, LGAs, and other advanced IC package types
- Expertise in high-voltage PCB layout techniques, including creepage/clearance management
- Familiarity with Signal Integrity and Power Integrity, as it applies to proper layout techniques
- Experience with high-speed PCB design, constraints management, and proper routing for interfaces with lane rates exceeding 1Gbps
- Knowledge of system level EMI mitigation techniques along with proper grounding/shielding architecture design
- Familiarity designing with FPGAs, System-On-Chips (SoC), and/or CPLDs using VHDL and/or Verilog
- Familiarity designing and writing embedded SW for microcontroller-based systems and modules
Company
Postal Code
Regular or Temporary
Posting Requirements
Department
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Preferred Skills and Education
- Master’s degree in Electrical Engineering, RF engineering, or equivalent
- Active DoD Security Clearance – Secret