Senior Process/Equipment Engineer - Semiconductor Tools bei WGNSTAR

WGNSTAR is a dynamic and growing company with a global footprint, primarily focused on the semiconductor industry. We’re excited to be partnering directly with one of our valued clients to fill a key position on their team. This is a unique opportunity to contribute to meaningful work in an innovative environment.

Schedule: Standard - Monday - Friday, 1st Shift; 9-80's also optional.
Pay Rate: Up to $245K. DOE.
Location: Baltimore, MD area - Relocation assistance is available.  
**Position being posted in other US Cities for Reach**
Travel:  10%
Position Type: Full-Time, Direct Hire


Principal Duties and Responsibilities: This is not an entry-level position; US Citizenship is Required.

• Lead process and/or equipment engineering efforts utilizing Applied Materials, (AMAT), tools, a combination of ENDURA, CENTURA, (dry etch and CVD) and MIRRA platforms. This position will focus on driving process optimization and enhancing equipment performance by collaborating with onsite AMAT FSO and engineering functions.  You will focus on improving various metrics including:
  • Process capability (CpK)
  • Equipment availability
  • Tool down escalations
  • Maintenance to ratio (M-ratio)
  • Mean Time to Repair (MTTR)
  • Mean Time Between Failures (MTBF)
  • Preventative Maintenance (PM) success rate
  • PM on-time and in-time metrics
• Provide informal guidance to process and equipment engineers while collaborating and directing Customer Engineers (CEs) in both conference room and hands-on settings.
• Create and review documents covering technical improvements, system upgrades, support plans, maintenance manuals and process Best Known Methods (BKMs).
• Serve as the primary point of contact for tool down escalations, liaising between AMAT and internal stakeholders such as Operations, Process Engineering, Equipment Engineering , and Site Director.
• Analyze equipment performance and troubleshoot issues, driving data-based methodologies to enhance yield and efficiency.
• Lead process optimization initiatives, developing and implementing strategies to resolve on-wafer issues and diagnostics of equipment.
• Collaborate with local and cross-functional teams to develop BKMs for the operation and upkeep of ENDURA, CENTURA and MIRRA tools.

Requirements:

• Bachelor's degree in Science, Technology, Engineering or Math AND 12+ years of related experience; or Master's degree in same and 10 years of related experience.
• Prior experience with leading OEMs and/or HVM fabs.
• Proven expertise with 200mm or 300mm semiconductor equipment, such as ENDURA, CENTURA, PRODUCER, and/or MIRRA platforms.
• Excellent analytical and problem-solving skills, capable of working independently and collaboratively in a team environment.
• Demonstrated experience in leading projects, mentoring colleagues, and fostering a culture of continuous improvement.
• Able to create and perform equipment and process partitioning to resolve hardware and/or process issues, such as failing mechanical and infilm defects, high film uniformity, failing VPD and more.
• Skilled at interpreting and modifying diagrams and schematics to effectively troubleshoot and resolve hardware issues.
• US CITIZENSHIP and ability to obtain and maintain a DoD Top Secret/SCI clearance with POLY REQUIRED.

Preferred:

• Expertise in fingerprinting a wide range of Applied Materials, (AMAT) equipment, including detailed assessments of hardware configurations, calibration parameters, and process variables.
• Strong understanding of experimental design methodologies, specifically full factorial and fractional factorial designs.
• Expertise in configuring and troubleshooting the ENDURA mainframe and process chambers, including optimization of processes to improve film uniformity, reduce defects, and increase overall throughput.
• Expertise in CENTURA etch eMXP+ systems, specializing in high-aspect-ratio etches on silicon, metal and dielectrics.
• Expertise in Centura CVD platforms to deposit high quality SIOx and SiN films, including modifying hardware and/or process.
• Expertise in MIRRA DESICA CMP for fully automated dry-in/dry-out planarization, including endpoint detection for multi-platen polishing, expertise in metal damascene and dielectric planarization, and knowledge in slurry chemistry and pad conditioning.

 
This job description is intended to convey information essential to understanding the scope of the job and the general nature and level of work performed by job holders within this job. This job description is not intended to be an exhaustive list of qualifications, skills, efforts, duties, responsibilities or working conditions associated with the position.