Reliability Engineer (Hardware) bei Lightmatter

The person in this role will be responsible for designing, executing, and analyzing reliability tests to verify product performance, durability, and compliance with standards. This role ensures that products meet or exceed reliability requirements throughout their lifecycle by developing robust test protocols, analyzing failures, and working with cross-functional teams to drive improvements in design and manufacturing processes.

Responsibilities

• Develop reliability test plans based on product requirements, industry standards, and customer expectations.
• Execute reliability qualification testing for our highly integrated photonics-based AI platform and our photonics chiplet communication fabric products.
• Conduct Failure Modes and Effects Analysis (FMEA) to identify and mitigate potential reliability risks in device design and manufacturing.
• Perform detailed root cause analysis of device failures, and collaborate with cross-functional teams to resolve reliability issues, refine product designs, and improve process robustness.
• Establish internal reliability guidelines and standards to meet customer requirements and industry benchmarks.
• Utilize statistical analysis tools to model reliability performance and predict device lifetimes under field conditions.
• Prepare and present detailed technical reports, including reliability test plans, results, and risk assessments, to internal and external stakeholders.

Qualifications 

• Minimum 3 years of experience in reliability engineering within semiconductor and/or photonics industry.
• Understanding of device and package reliability testing methodologies, including HTOL, HAST, TDDB, HTHH, TC etc.
• Hands-on experience with failure analysis tools and techniques such as SEM, TEM, FIB, and EMMI etc.
• Knowledge of device physics, reliability and failure mechanism in Serdes/digital/mixed signal IC’s.
• Good understanding of packaging failure mechanisms and risks on TSV, solder joints, warpage, metal migrations etc.
• Familiarity with reliability modeling tools and statistical analysis (e.g., Weibull analysis, Minitab, JMP).

Preferred Qualification:

• Preferably experienced in semiconductor or photonics device/module testing.
• Experience with advanced packaging technologies such as flip-chip, wafer-level packaging, or 3D integration.
• Good statistical data analysis skills to analyze pre vs post reliability data.
• Excellent communication and presentation skills, with the ability to convey complex reliability concepts to diverse audiences.