Thermal Design Engineer presso Cornelis Networks, Inc.

Cornelis Networks delivers the world’s highest performance scale-out networking solutions for AI and HPC datacenters. Our differentiated architecture seamlessly integrates hardware, software and system level technologies to maximize the efficiency of GPU, CPU and accelerator-based compute clusters at any scale. Our solutions drive breakthroughs in AI & HPC workloads, empowering our customers to push the boundaries of innovation. Backed by top-tier venture capital and strategic investors, we are committed to innovation, performance and scalability - solving the world’s most demanding computational challenges with our next-generation networking solutions. 

We are a fast-growing, forward-thinking team of architects, engineers, and business professionals with a proven track record of building successful products and companies. As a global organization, our team spans multiple U.S. states and six countries, and we continue to expand with exceptional talent in onsite, hybrid, and fully remote roles. 

Cornelis Networks is seeking a talented Thermal Design Engineer with experience in system and printed circuit board (PCB) development and design. This engineer will be involved in the design of all phases of thermal management of high-performance electronics, from conception through end-of-life, of the next-generation Cornelis Networks Fabric platforms.

Key Responsibilities

• Simulate & Model: Execute computational fluid dynamics (CFD) and thermal simulations, including modeling, pre-/post-processing, and analysis.
• Lab Testing & Validation: Perform thermal measurements and qualification testing; correlate empirical data with simulation results for validation.
• Design Thermal Guidelines: Develop and document design guidelines based on simulation and 3D modeling insights.
• Comprehensive Thermal Design Ownership: Lead thermal design across all levels: from chip and PCB, to subsystem and chassis, up through rack and data center integration. Manage trade-offs between thermal performance, mechanical constraints, and cost, ensuring designs meet requirements from concept through end-of-life.
• Cross Functional Collaboration: Partner with mechanical, electrical, firmware/software, system test, and manufacturing teams to drive product readiness and move into production.
• Thermal Roadmap & Process Improvement: Contribute to the definition of the thermal roadmap and drive continuous improvements in design workflows and processes across product lifecycles.

Minimum qualifications

• 4+ years of combined professional and/or academic experience in thermal management of electronics, particularly involving PCBs and system-level assemblies.
• BS in Mechanical Engineering with a focus in Thermodynamics, Heat Transfer, or Thermal Engineering.
• Proficient in CFD tools, Cadence Celsius preferred; experience with other industry standard CFD tools is a plus.
• Proficiency with MCAD tools, CREO preferred, SolidWorks acceptable.
• Strong hands-on experience in thermal validation labs: thermal sensor use, data acquisition, instrumentation, test execution, and data analysis.
• Familiarity with both air and liquid cooling methods, heat sinks, cold plates, heat pipes, and thermal interface materials (TIMs).
• Experience with technical documentation, including assembly procedures, thermal engineering guidelines, and validation documentation.
• Excellent communication and interpersonal skills; accustomed to cross-disciplinary teamwork.

Preferred qualifications:

• Experience or familiarity with PCB layout concepts and tools such as Cadence Allegro, Mentor, or similar.
• Scripting experience, especially Python, for automation, thermal data analysis, or test workflows.
• Pre-silicon or post-silicon validation planning, including chip/package characterization.
• Experience collaborating with suppliers or vendors for thermal component development and qualifications.
• Familiarity with system-level thermal considerations in high-performance computing or data center environments.

Location: This is a hybrid position based at our headquarters in the Chesterbrook Corporate Center in Wayne, PA, with the flexibility for occasional remote work.

We offer a competitive compensation package that includes equity, cash, and incentives, along with health and retirement benefits. Our dynamic, flexible work environment provides the opportunity to collaborate with some of the most influential names in the semiconductor industry.

At Cornelis Networks your base salary is only one component of your comprehensive total rewards package. Your base pay will be determined by factors such as your skills, qualifications, experience, and location relative to the hiring range for the position. Depending on your role, you may also be eligible for performance-based incentives, including an annual bonus or sales incentives.

In addition to your base pay, you’ll have access to a broad range of benefits, including medical, dental, and vision coverage, as well as disability and life insurance, a dependent care flexible spending account, accidental injury insurance, and pet insurance. We also offer generous paid holidays, 401(k) with company match, and Open Time Off (OTO) for regular full-time exempt employees. Other paid time off benefits include sick time, bonding leave, and pregnancy disability leave.

Cornelis Networks does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. Cornelis Networks is an equal opportunity employer, and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity or expression, pregnancy, age, national origin, disability status, genetic information, protected veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.