R&D Engineer - Semiconductor Heterogeneous Integration en Keysight Technologies, Inc.

Keysight is at the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~15,000 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more about what we do.

Our award-winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers.

We focus on process development, process integration, and New Product Introduction. You will lead the development of next-generation System in Package (SiP) modules that will be integrated with microwave and mmWave subsystems across Keysight, serving multiple industries.

Responsibilities may include:

• Develop and maintain wafer fabrication processes
• Develop and maintain package assembly processes
• Specify, select and qualify new equipment
• Contribute to process automation
• Review new designs for manufacturability and provide feedback to module designers
• Understand process flows, product design and performance requirements, and lead manufacturing teams to develop new products that meet performance targets
• Lead technical development of new SiP introductions in collaboration with upstream design teams, process and manufacturing teams, and downstream customer teams
• Meet accelerated project schedules; communicate and manage risks
• Develop and maintain high yields while adhering to project schedules

We are seeking an industry professional with proven expertise in one or more of the following areas:

• Design for manufacturing of electromechanical assemblies
• Statistical process control (SPC), design of experiments (DOE)
• Thermocompression / flip chip bonding
• Surface Mount Technology (SMT) processes
• Die singulation
• Semiconductor fabrication processes
• Heterogeneous integration, advanced packaging techniques
• New technology introduction
• New product introduction

This role requires strong leadership, drive, and ambition to realize a novel technology that differentiates Keysight in 6G markets. Excellent interpersonal and communication skills are important for successful cross-functional interactions.

BS or MS in Mechanical Engineering, Manufacturing Engineering, Materials Science, Physics, Chemistry, or relevant fields.

Professional experience in the following areas is desired:

• III-V compound semiconductors and/or silicon technologies
• Thermal, mechanical and electrical reliability
• Technical project management, project lifecycle

Careers Privacy Statement***Keysight is an Equal Opportunity Employer.***

The level of role will be based on applicable experience, education and skills; Most offers will be between the minimum and the midpoint of the Salary Range listed below.

California Pay range: $128,670.00 - $214,440.00

US Employees may be eligible for the following benefits:

• Medical, dental and vision
• Health Savings Account
• Health Care and Dependent Care Flexible Spending Accounts
• Life, Accident, Disability insurance
• Business Travel Accident and Business Travel Health
• 401(k) Plan
• Flexible Time Off, Paid Holidays
• Paid Family Leave
• Discounts, Perks
• Tuition Reimbursement
• Adoption Assistance
• ESPP (Employee Stock Purchase Plan)
• Restricted Stock Units