Automatic/Manual Wire Bonding Operator en MACOM Technology Solutions Holdings, Inc.

MACOM designs and manufactures semiconductor products for Data Center, Telecommunication, and Industrial and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe, and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard.

MACOM has more than 75 years of application expertise with multiple design centers, Si, GaAs, and InP fabrication, manufacturing, assembly and test, and operational facilities throughout North America, Europe, and Asia. Click here to view our facilities. https://www.macom.com/. In addition, MACOM offers foundry services that represents a key core competency within our business.

MACOM sells and distributes products globally via a sales channel comprised of a direct field sales force, authorized sales representatives, and leading industry distributors. Our sales team is trained across all of our products to give our customers insights into our entire portfolio.

Automatic/Manual Wire Bonding Operator

Job Description

 This role will be an assembly operator working with Automatic/Manual wire bonding.

Responsibilities:

•  Works under direction and from production schedules, manufacturing procedures, process plans and written or oral instruction.
• Operate and set-up Automatic Gold wire/ribbon bonders (Palomar 8000, H+K 820 systems or F&K Delvotec) per micro-circuit layout drawings
• Operator is responsible for proper wire formation, bond appearance and bond strength.
• Flexibility to be trained in multiple Microelectronics processes that involve ball & wedge wire bonding
• Capable of performing bond pull/die shear and plotting SPC with data
• Familiarity of the use of plasma cleaning and other surface preparation for semiconductors and substrates
• Requires significant attention to detail for production activities and documentation to maintain compliance with MIL-STD 883 requirements
• Familiarity with FOD prevention and management
• Familiar with ESD controls

Experience and Education

• Ability to set-up, operate and adjust (Plaomar 8000, H+K 820 systems or F&K Delvotec) or ability to learn to run a variety of microelectronic production equipment.
• Minimum of 2 years' experience in microelectronics module assembly area.
• High School diploma required.

Knowledge and Skill Requirements:  

• Gold wire/ribbon bonding to a variety of die and substrates.
• Capable of programming equipment helpful
• Capable of threading wire

Physical Environment and Working Conditions:

• Clean-room environment with Smocks, masks and gloves.

Due to ITAR regulations, only candidates who are U.S. Persons (U.S. citizens, U.S. nationals, lawful permanent residents, or individuals granted asylum or refugee status) will be considered for this position.

EEO:

MACOM is an Equal Opportunity Employer committed to a diverse workforce. MACOM will not discriminate against any worker or job applicant on the basis of race, color, religion, sex, gender identity, sexual orientation, national origin, age, disability, genetic information, veteran status, military service, marital status, or any other category protected under applicable law.

Reasonable Accommodation:

MACOM is committed to working with and providing reasonable accommodations to qualified individuals with physical and mental disabilities. If you have a disability and are in need of a reasonable accommodation with respect to any part of the application process, please call +1-978-656-2500 or email [email protected]. Provide your name, phone number and the position title and location in which you are interested, and nature of accommodation needed, and we will get back to you. We also work with current employees who request or need reasonable accommodation in order to perform the essential functions of their jobs.